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STA PT 1600 – Rubber – Decomposition

DIL L75 VS CRYO - Copper - Thermal expansion

THB 100 – Rubber Compounds – Thermal conductivity

TIM-Tester – Vespel – Thermal conductivity, Thermal Impedance - Glass Adhesive

TIM-Tester – Metal sheets with adhesive layer - Thermal Conductivity and Thermal Impedance

STA PT 1600 – Cement sample – STA

TGA PT 1600 – Gypsum plaster decomposition

Chip-DSC 1 – crude oil analysis – wax appearance temperature

Chip-DSC 100 – Xerogel nanoparticles

DIL L75 VS HT – graphite – Thermal expansion

LFA 1000 – Sodium Nitrate – Thermal conductivity

STA HP 1 – Pressure dependent decomposition – High pressure Thermogravimetry

THB 100 – Ethanol-water-solution – Thermal conductivity

TFA - thermoelectric thin film - thermoelectric properties - metals and alloys

Chip DSC 1 – Indium melting – Heating rates

LFA 1000 – Refractory – Thermal diffusivity

LFA 1000 – graphite – Thermal conductivity / thermal diffusivity

FA 1000 – Copper – In-/Trough-Plane – Thermal diffusivity – Thermal Conductivity

LFA 1000 – Steel foil – Thermal diffusivity

STA PT 1600 HS – calcium oxalate – high speed inductive STA

Hall system – Hall coefficient – Inorganics/semiconductors

HCS – Hall coefficient – Inorganics/semiconductors

HCS – Hall coefficient – Inorganics/semiconductors

LSR – Bismuth telluride – Direct ZT measurement of the NIST Bi2Te3

LSR – Constantan – Seebeck coefficient – Thermoelectric properties

LSR – Silicon Germanium alloy – Seebeck coefficient/Electrical conductivity

THB Advance/Basic – Phase change material – Thermal conductivity

DIL L75 VS – Glass rod – Thermal expansion

DIL L75 VS – Quarz – Thermal expansion – calculated DTA

DIL L75 VS – Zirconia – Rate controlled sintering (RCS)

DSC PT 1600 – Thermophysical properties of glasses

HFM – Window Glass – Thermal transmittance – Horizontal vs. Vertical Measurement

LFA 1000 – Aluminum oxide Al2O3 – Thermal diffusivity/ conductivity

LFA 1000 – BCR 724 – Thermal conductivity / thermal diffusivity

LFA 1000 – Carbide Ceramics – Thermal Conductivity

LFA 1000 – Glass – Thermal diffusivity /Thermal Conductivity /Specific Heat Capacity

Chip-DSC 10 – DSC of pharmaceuticals – Glass point sorbitol

chip-DSC 10 – Food industry – Lactose characterization of glass transitions

Chip-DSC 10 – food testing with DSC – butter and margarine

Chip-DSC 10 – foods on DSC – chocolate

STA PT 1000 – Thermal behavior of banana pseudostems

THB 100 – Milk powder – Thermal conductivity

Quenching DIL – Steel rod – Thermal expansion / Deformation

DIL L75 VS – Iron – Thermal expansion

LFA 1000 – Determination of welding heat source parameters

LFA 1000 - Inconel 600 - Thermal diffusivity/thermal conductivity

LFA 1000 – copper and aluminum – Thermal diffusivity

LFA 1000 – Steel alloys – Thermal conductivity / thermal diffusivity / specific heat

LSR-1 – Alumel – Absolute Seebeck coefficient

LSR-1 – Constantan – Seebeck effect

LSR – Copper – Electric conductivity

STA HP 1 – Heat of Adsorption – HP HDSC

STA PT 1600 – Determination of the melting behaviour of aluminium oxide (Al2O3) in high temperature applications

STA PT 1600 – Melt analysis of palladium

THB Basic – Aluminium Alloy – Thermal conductivity

DIL L75 HS 1600 – Thermal expansion of BNMO and BCZY712

Thermal diffusivity measurement on Molten Salts using LFA 1000

LSR – Constantan – Seebeck coefficient – Thermoelectric properties

STA HP1 – Coal gasification – HP STA

Stability of Molten Salts using Simultaneous Thermal Analysis - STA PT 1000

STA PT 1600 – Titanium hydride – STA

Chip-DSC 10 – Cp of polymer – modulated cp

Chip-DSC 10 – Polymers – PET

Chip-DSC 10 – Polymer sample (PE) – characterization of polymers

Chip-DSC 10 – Polymer sample (PP) – characterization of polymers

Chip-DSC 10 – UV curing of polymers – resin curing

Chip-DSC 100 – Oxidation of polymer – OIT (oxidation induction time)

Chip-DSC – Polymer sample (ABS) – characterization of polymers

DIL L75 VS HT LT – Elastomer – Thermal expansion

HFM – Epoxy – Thermal conductivity

LFA 500 – Polyethylene (PE) – Thermal diffusivity

THB 100 – Epoxy – Thermal conductivity

THB 100 – Pressed tube material – Thermal conductivity

THB 100 – Ceramic filled polymer – Thermal conductivity

TIM-Tester – Vespel – Thermal conductivity, Thermal Impedance in Polymers

TIM-Tester – Vespel – Thermal Conductivity

Analysing asphalt with DSC

STA PT 1600 – gypsum sample – TGA+DSC

Thermal analysis of copper fibres

Chip-DSC 1 – Enthalpy of explosives – high energy DSC

LFA 1000 - Silicone oils - Thermal conductivity

TFA - thermoelectric thin film - thermoelectric properties - semiconductor

LFA 1000 - Multilayer sample - Thermal conductivity

HDSC PT 1600 - Low alloy steel - DSC

TFA - thermoelectric thin film - thermoelectric properties - metals and alloys

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Publications on thermal analysis

TF-LFA - CVD Diamond - Thermal conductivity

USA

Linseis Inc.
109 North Gold Drive
Robbinsville, NJ 08691

Europe

Linseis Messgeraete GmbH
Vielitzerstr. 43
95100 Selb / Germany

China

Linseis Shanghai Scientific
Room 120, Building T3, No.1220 Yuqiao Road, Pudong, Shanghai

India

Linseis Thermal Analysis India Pvt. Ltd.
Plot 65, 2nd Floor, Sai Enclave,
Sector 23, Dwarka, 110077 New Delhi