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Applications of Thermal Analysis, Calorimetry, Dilatometry, and Thermophysical Properties

Find the right measurement solution for your material, industry, or application

Our applications offer solutions for characterizing materials in terms of their thermal, thermophysical, and calorific properties, phase transitions, and stability.

Select your industry, application, or measurement method to find the right analysis for your needs—from DSC to TGA and dilatometry to thermal conductivity measurement.

We would be happy to assist you with specific questions or conduct measurements for you in our lab.

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Industry Solutions in Materials Analysis

Discover practical applications and measurement solutions for a wide variety of industries and materials.

Energy & Batteries

Analysis of battery materials, hydrogen systems, and energy storage devices

• Thermal Runaway
• Heat Capacity
• Material Stability

Automotive & Aviation

Material Analysis for Lightweight Construction, High-Temperature, and Cryogenic Applications

• High-Temperature Materials
• Cryotechnology
• Alloys

Polymers

Characterization of Aging, Recycling, and Thermomechanical Behavior

• Glass transition
• Oxidation & Aging
• Thermomechanics

Chemistry

Analysis of Reactions, Catalysts, and Metabolic Processes

• Reaction Kinetics
• Sorption
• Catalysts

Semiconductors and Electronics

Thermal Management and Materials Analysis for Modern Electronics

• TIMs & Packaging
• Thermal Conductivity
• Wide Band Gap Materials

Metals and alloys

Investigation of Alloys, Phase Transitions, and High-Temperature Behavior

• Phase diagrams
• High-Temperature Materials
• Microstructure Analysis

Ceramics & Technical Ceramics

Analysis of Sintering Processes, Ceramic Insulators, and High-Performance Ceramics

• Sintering processes
• High-Temperature Ceramics
• Insulators

Glasses

Analysis of Technical and Optical Glasses

• Thermomechanics
• Optical Glasses
• Expansion Behavior

Building Materials

Material Testing for Construction, Insulation, and Fire Protection

• Insulation Materials
• Cement
• Fire protection

Pharmaceuticals, Food & Life Sciences

Analysis of Stability, Shelf Life, and Biological Materials

• Active Ingredient Stability
• Protein Analysis
• Aging

New Technologies

Research on Innovative Materials and Coatings

• Nanotechnology
• Thin Films
• Coatings

Research & Higher Education

Solutions for Basic Research and Materials Development

• Material Development
• Composites
• Basic Research

Typical Applications of Thermal Analysis

Find the right analysis for your specific needs—regardless of industry or material.

Applications:

Applications:

Applications:

Oxidation
Thermal decomposition
Aging & Service Life
Long-term stability

Applications:

Applications:

Thermal Expansion (CTE)
Shrinkage & Sintering Behavior
Stress & Distortion
Thermomechanical Analysis (TMA)

Applications:

Thin film analysis
Coatings
Interfacial Behavior

Measurement Methods in Materials Analysis

Choose the right analytical method for your application—from calorimetric techniques to thermal conductivity measurements.

Differential Scanning Calorimetry (DSC)

Analysis of phase transitions such as glass transition, melting, and crystallization.

Typical applications:

Glass transition (Tg)
Melting behavior
Heat Capacity

Thermogravimetry (TGA)

Determination of changes in mass due to decomposition, oxidation, or evaporation.

Applications:

Decomposition
Oxidation
Moisture content

Laser Flash Analysis (LFA)

Measurement of thermal diffusivity and calculation of thermal conductivity.

Applications:

Thermal conductivity
Thermal Conductivity
High-Temperature Measurements

Dilatometry (DIL)

Analysis of changes in length and thermal expansion of materials.

Applications:

CTE
Sintering behavior
Phase Transitions

Simultaneous Thermal Analysis (STA)

Combination of DSC and TGA for the simultaneous analysis of heat flow and mass.

Applications:

Reactions
Decomposition
Phase Analysis

Special Methods & Couplings

Advanced analysis through integration with gas analysis or specific measurement methods.

Applications:

Applications of Materials Analysis

Search through all applications by industry, measurement method, or application to find the right solution for your specific needs.

STA L81 – Rubber Degradation

DIL L75 Vertical Single CRYO – Copper – Thermal Expansion

THB Ultimate (THB L56 Ultimate) – Rubber Compound – Thermal Conductivity

TIM Tester (TIM L58) – Vespel – Thermal Conductivity and Thermal Impedance

TIM Tester (TIM L58) – Metal Plates with Adhesive Coating – Thermal Conductivity and Thermal Impedance

STA L81 – Cement – STA

TGA L81 – Decomposition Measurement of Exterior Plaster

Chip-DSC 1 (Chip-DSC L66 Basic) – Crude Oil Analysis – Wax Appearance Temperature

Chip-DSC 100 (Chip-DSC L66 Ultimate) – Xerogel Nanoparticles

DIL L75 Vertical Single HT – Graphite – Thermal Expansion

LFA L52 – Sodium Nitrate – Thermal Conductivity

STA HP L84 – Pressure-Dependent Decomposition – HP TGA

THB 100 (THB L56 Ultimate) – Ethanol-water solution – Thermal conductivity

Chip DSC 1 (Chip-DSC L66 Basic) – Indium melting – Heating rates

LFA L52 – Refractory – Thermal diffusivity

LFA L52 – graphite – Thermal conductivity / thermal diffusivity

LFA L52 – Copper – In-/Trough-Plane – Thermal diffusivity – Thermal Conductivity

LFA L52 – Steel foil – Thermal diffusivity

STA L81 HS – calcium oxalate – high speed inductive STA

Hall System (HCS L36) – Hall Coefficient – Inorganic Materials/Semiconductors

HCS (HCS L36) – Hall Coefficient – Inorganic Materials/Semiconductors

HCS (HCS L36) – Hall Coefficient – Inorganic Materials/Semiconductors

LSR (LSR L31) – Bismuth telluride – electrical conductivity / thermal conductivity / thermoelectric properties

LSR (LSR L31) – Constantan – thermoelectric properties – Seebeck coefficient

LSR (LSR L31) – Silicon-Germanium Alloy – Seebeck Coefficient / Electrical Conductivity

THB L56 Advanced/Basic – Phase-Change Material – Thermal Conductivity

DIL L75 Vertical Single – Glass Rod – Thermal Expansion

DIL L75 Vertical – Quarz – Thermal expansion – calculated DTA

DIL L75 Horizontal – Zirconia – Rate controlled sintering (RCS)

HDSC L62 – Thermophysical properties of glasses

HFM L57 – Window Glass – Thermal transmittance – Horizontal vs. Vertical Measurement

LFA L52 – Aluminum oxide Al2O3 – Thermal diffusivity/ conductivity

LFA L52 – BCR 724 – Thermal Conductivity/Temperature Conductivity

LFA 1000 – Carbide Ceramics – Thermal Conductivity

LFA L52 – Glass – Thermal Conductivity / Temperature Conductivity / Specific Heat Capacity

Chip-DSC 10 (Chip-DSC L66 Advanced) – DSC of Pharmaceuticals – Glass Transition Temperature of Sorbitol

Chip-DSC 10 – Food industry – Lactose characterization of glass transitions

Chip-DSC 10 (Chip-DSC L66 Advanced) – Food Industry (Lactose) – Characterization of Glass Transitions

Chip-DSC 10 (Chip-DSC L66 Advanced) – foods on DSC – chocolate

STA L82 – Thermal behavior of banana pseudostems

THB Basic/Advanced/Ultimate (THB L56) – Milk powder – Thermal conductivity

DIL L78 Quenching Tank – Steel Rod – Thermal Expansion / Deformation

DIL L75 Vertical Single – Iron – Thermal Expansion

LFA L52 – Determination of the Parameters of the Welding Heat Source

LFA L52 – Inconel 600 – Thermal Conductivity

LFA L52 – Copper and Aluminum – Thermal Conductivity

LFA L52 – Steel Alloys – Thermal Conductivity/Temperature Conductivity/Specific Heat

LSR L32 – Alumel – Absolute Seebeck Coefficient

LSR L32 – Constantan – Seebeck Effect

LSR L31 – Copper – Electrical Conductivity

STA HP L84 – Heat of Adsorption – HP HDSC

STA L81 – Determination of the Melting Behavior of Aluminum Oxide (Al₂O₃)

STA L81 – Melt Analysis of Palladium

THB Basic (THB L56 Basic) – Aluminum Alloy – Thermal Conductivity

DIL L75 HS 1600 – Thermal expansion of BNMO and BCZY712

LFA L52 - Thermal diffusivity measurement on Molten Salts

LSR L33 – Constantan – Seebeck coefficient – Thermoelectric properties

STA HP L84 – Coal gasification – HP STA

STA L82 - Stability of Molten Salts using Simultaneous Thermal Analysis

STA L81 – Titanium hydride – STA

Chip-DSC 10 (Chip-DSC L66 Advanced) – Cp of a polymer – modulated Cp

Chip-DSC 10 (Chip-DSC L66 Advanced) – Polymers – PET

Chip-DSC 10 (Chip-DSC L66 Advanced) – Polymer sample (PE) – characterization of polymers

Chip-DSC 10 (Chip-DSC L66 Advanced) – Polymer Sample (PP) – Characterization of Polymers

Chip-DSC 10 (Chip-DSC L66 Advanced) – UV Curing of Polymers – Resin Curing

Chip-DSC 100 (Chip-DSC L66 Ultimate) – Polymer Oxidation – OIT (Oxidation Induction Time)

Chip-DSC 1 (Chip-DSC L66 Basic) – Polymer Sample (ABS) – Characterization of Polymers

DIL L75 Vertical Single HT LT – Elastomer – Thermal Expansion

HFM L57 – Epoxy – Thermal Conductivity

LFA L51 – Polyethylene (PE) – Thermal Conductivity

THB Basic/Advanced/Ultimate (THB L56) – Epoxy – Thermal conductivity

THB Ultimate (THB L56 Ultimate) – Extruded Tubing – Thermal Conductivity

THB Ultimate (THB L56 Ultimate) – Ceramic-Filled Polymer – Thermal Conductivity

TIM Tester (TIM L58) – Vespel – Thermal Conductivity, Thermal Impedance

TIM Tester (TIM L58) – Vespel – Thermal Conductivity

Analysing asphalt with DSC

Thermal Analysis of Gypsum Using the STA L81

Thermal analysis of copper fibres

Chip DSC 1 (Chip-DSC L66 Basic) – Explosive Enthalpy – High-Energy DSC

LFA L52 – Silicone Oils – Thermal Conductivity

TFA L59 - thermoelectric thin film - thermoelectric properties - semiconductor

LFA L52 - Multilayer sample - Thermal conductivity

HDSC L62 – Low-Alloy Steel – DSC

TFA L59 – Thin-film thermoelectric – Thermoelectric properties – Metals and alloys

TF-LFA L54 - CVD Diamond - Thermal Conductivity

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