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Thermal analysis & polymer characterization

Whether PE (polyethylene), PVC (polyvinyl chloride), PP (polypropylene) or biopolymers – plastics have become indispensable in today’s life. They are found in multiple applications such as shampoo bottles, toys, automotive parts, in medicine, or in the aerospace industry.

It is essential to know characteristics such as melting point, glass transition, crystallinity, thermal stability and aging, in order to be able to select the right polymer for the respective application. This knowledge helps to understand the peculiarities of raw materials and end products. This is an important prerequisite for optimizing the production processes and achieving the specifications required for the end use.

Polymers are generally divided into three main groups:

  • thermoplastics
  • thermosets
  • elastomers

The thermal properties of all these plastics can be determined with the support of thermoanalytical measurement systems from Linseis. They can be used in product development as well as in process optimization, quality assurance, and damage analysis.

Due to its versatility and informative value, differential scanning calorimetry (DSC) is currently the most commonly used thermal analysis method in the plastics sector. In addition, for the polymer industry, LINSEIS offers other high-quality measuring instruments such as heating microscopes, optical dilatometers, Light Flash Analyzer for thermal conductivity determination or the world’s only pressure dilatometer.

polyethylen als verpackung

Polyethylen packaging in food industries

polymere im interieur eines fahrzeuges

polymers in automotive industries e.g. interieur

PVC floor

PVC floor

Polymer Applications

 

Chip-DSC 10 – Polymers – PET

App. Nr. 02-011-002 Chip-DSC 10 – Polymers – PET

>> Application

 

Chip-DSC 10 – Cp of polymer – Modulated Cp

App. Nr. 02-011-001 Chip DSC 10 – Cp of polymer – modulated cp

>> Application

 

Chip-DSC 100 – Oxidation of polymer – OIT

App. Nr. 02-011-008 Chip DSC 100 – Oxidation of polymer – OIT (oxidation induction time)

>> Application

 

HFM – Epoxy – Thermal conductivity

App. Nr. 02-005-001 HFM – Epoxy – Thermal conductivity

>> Application

 

THB 100 – Epoxy – Thermal conductivity

App. Nr. 02-006-001 THB 100 – Epoxy – Thermal conductivity

>> Application

 

THB 100 – Pressed tube material – Conductivity

THB 100 - Pressed tube material – Thermal conductivity

>> Application

 

Chip-DSC 10 – UV curing of polymers – resin curing

App. Nr. 02-011-005 Chip DSC 10 – UV curing of polymers – resin curing

>> Application

 

THB 100 – Ceramic filled polymer – Thermal conductivity

App. Nr. 02-006-003 THB 100 – Ceramic filled polymer – Thermal conductivity

>> Application

TIM-Tester – Vespel – Thermal conductivity, Thermal Impedance

App. Nr. 02-00-00 TIM-Tester – Vespel – Thermal conductivity, Thermal Impedance

>> Application

 TFA – thermoelectric thin film PEDOT:PSS

App. Nr. 02-013-003 TFA – thermoelectric thin film – thermoelectric properties - semiconductor

>> Application

TIM-Tester – Vespel – Thermal Conductivity

App. Nr. 02-008-002 TIM-Tester – Vespel – Thermal Conductivity Measurement

>> Application

Chip-DSC – Polymer sample (ABS) – characterization of polymers

App. Nr. 02-011-010 Differential Scanning Calorimeter - Chip-DSC 1 – Thermal analysis of ABS

>> Application

Chip-DSC 100 – Xerogel nanoparticles

App. Nr. 02-011-012 - Differential Scanning Calorimeter - Chip-DSC 100 – Xerogel nanoparticles

>> Application

Chip-DSC 10 – Polyethylene (PE) – characterization of polymers

App. Nr. 02-011-013 Chip DSC 10 - Polyethylene (PE)

>> Application

Chip-DSC 10 – Polypropylene (PP) – characterization of polymers

App. Nr. 02-011-014 Chip DSC 10 - PP -polypropylene

>> Application