Properties in the field of thermal analysis
The development of materials and processes, the construction and operation of machinery and equipment and the construction of structures require the knowledge of material properties. In physics, chemistry and materials science, these properties are described by physical measures. Some of these sizes are also the basis for process control and quality assurance in production.
The thermal analysis enables the precise and rapid determination of the substance sizes and their change depending on the temperature:
- Modulus of elasticity
- Mass change
- Heat flow
- thermal expansion coefficient
- electric conductivity
- contact angle
- specific heat capacity
- thermal conductivity
- thermal diffusivity
- Hall coefficient
- Seebeck coefficient
- Heat transfer coefficient (U value) and
- ZT- Figure of merit
In addition, she leaves the investigation
- heat consumption or heat release in the course of chemical reactions,
- the change in the sample mass due to evaporation or sublimation, as well as
- the degree of addition of gases to solid surfaces (sorption) too.
The measurements are based on various thermoanalytical methods, in which the relationships between electrical or optical and thermal variables are used.
To the methods belong
- Differential thermal analysis (DTA) to determine the temperature
- Differential Scanning Calorimetry (DSC) to determine heat flux and enthalpy
- Thermogravimetry (TG) for determining mass changes
- Dilatometry or thermomechanical analysis (TMA) to determine changes in length.
In the Thermal Analysis business unit, Linseis provides the complete range of these measuring instruments. The offering includes Simultaneous Thermal Analysis (STA) devices that enable the simultaneous acquisition of various physical measures.
The software integrated in the measuring instruments calculates the sought-after substance quantities from the measured values and provides diagrams that illustrate the behavior of the samples under the influence of incoming or outgoing heat.