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Thermoelectric Analysis for Semiconductors & Electronics

Semiconductors such as silicon (Si), germanium (Ge), gallium arsenide (GaAs) or cadmium sulfide (CdS) have become indispensable in electrical engineering. Not only do they form the basis for electronic devices such as computers, displays and smartphones, they are also becoming increasingly important in the generation of light.

Semiconductor materials and electronic components based on these diverse materials and difficult manufacturing process are hard to analyze and characterize. The remedy is provided by modern thermoanalytical measuring techniques which, among other things, provide answers to the following questions:

  • Under what circumstances does a silicon chip break?
  • What is the thermal conductivity of an electronic component?
  • What behavior do thermal sensors show at very high temperatures?
  • Has the adhesive system hardened enough?
  • Does the heat path of a component indicate weak points?

The thermal behavior of semiconductor components during application can be determined with thermoanalytical measuring methods as well as the efficiency of process steps including the layer structure and adhesion properties. The control of implantation profiles (e.g. boron in silicon) or clean room air (e.g. organic components) can also be realized.

Whether your task is product development, quality control, process optimization or damage analysis, Linseis can provide you with the proper product to enhance your investigations. There are countless fields of application for thermal analysis methods such as differential scanning calorimetry (DSC), thermogravimetry (TGA) or thermal (TCA) and electrical transport (HCS) measurement using the LaserFlash (LFA) technique or our proven LSR platform. LINSEIS leads the way in product capability.

silicon wafer

silicon wafer

resistors

resistors

micro chip

micro chip

electronic components

electronic components: circuit board

Applications with Semiconductors

 

HCS – Hall coefficient – Bismuth Antimony

App. Nr. 02-010-002 HCS – Hall coefficient – Inorganics semiconductors

>> Application

 

Hall system – Hall coefficient – Indium tin oxide (ITO)

App. Nr. 02-010-003 Hall system – Hall coefficient – Inorganics or semiconductors

>> Application

 

HCS – Hall coefficient – Antimony thin film

App. Nr. 02-010-003 Hall system – Hall coefficient – Inorganics or semiconductors

>> Application

 

LSR – Bismuth telluride – Figure of Merit ZT

App. Nr. 02-009-002 LSR – Bismuth telluride –Figure of Merit ZT Seebeck coefficient Electrical conductivity Thermal conductivity Thermoelectric properties

>> Application

 

LSR – Constantan – Seebeck coefficient

App. Nr. 02-009-004 LSR – Constantan – Seebeck coefficient - Thermoelectric properties

>> Application

 

LSR – Silicon Germanium alloy – Seebeck coefficient

App. Nr. 02-009-001 LSR – Silicon Germanium alloy – Seebeck coefficient Electrical conductivity

>> Application

 

TFA – thermoelectric thin film Au

App. Nr. 02-013-002 TFA – thermoelectric thin film – thermoelectric properties – metals&alloys 2

>> Application

 

TFA – thermoelectric thin film Bi87Sb13

App. Nr. 02-013-001 TFA – thermoelectric thin film – thermoelectric properties - semiconductor

>> Application

 

TFA – thermoelectric thin film PEDOT:PSS

App. Nr. 02-013-003 TFA – thermoelectric thin film – thermoelectric properties - semiconductor

>> Application

 

LSR – Copper – Electric conductivity

App. Nr. 02-009-005 LSR – Copper – Electric conductivity

>> Application

 

LSR – Constantan – Seebeck coefficient

App. Nr. 02-009-003 LSR – Constantan – Seebeck coefficient - Thermoelectric properties

>> Application

TIM-Tester – Vespel – Thermal Conductivity

App. Nr. 02-008-002 TIM-Tester – Vespel – Thermal Conductivity Measurement

>> Application