THB 100 – Ceramic filled polymer – Thermal conductivity
Polymer – Thermal Conductivity, Thermal Diffusivity, Specific Heat
Composite materials are widely used from electronic to building materials industries. A big variety of additives are known and used in this material technology, in order to optimize their material properties. Nevertheless, the final properties of these materials can vary widely, due to production conditions and deviating mixtures, making a accurate process and quality control crucial.
The following measurement illustrates a quality control application by determine the thermal conductivity, thermal diffusivity and specific heat of a ceramic filler polymer performed on a THB-100 (Transient Hot Bridge Instrument). For that, the sample and the sensor (sandwich-setup) were placed in a furnace where the measurement was performed from room temperature to 90°C. The specific heat of the sample increases, whereas the thermal diffusivity decreases within the temperature range. The thermal conductivity is almost constant at 0.44 W/mK and shows only slight increases and decreases of the value. This behavior is characteristic for the investigated material and would change with composition.