THB 100 – Ceramic filled polymer – Thermal conductivity
Polymer – Thermal Conductivity, Thermal Diffusivity, Specific Heat
To optimize material properties a big variety of additives are known and used in material technologies and composite materials are of big interest, too. Even more important is the exact examination of the real properties of these materials, which can vary widely due to production conditions and mixture. Composite materials are widely used from electronic to building materials industries.
App. Nr. 02-006-003 THB 100 – Ceramic filled polymer – Thermal conductivity
The following measurement illustrates the determination of the thermal conductivity, thermal diffusivity and specific heat of a ceramic filler polymer performed on a THB-100 (Transient Hot Bridge Instrument). For that the sample and the sensor (sandwich-setup) were placed in a furnace where the measurement was performed from room temperature to 90 °C. The specific heat of the sample increases, whereas the thermal diffusivity decreases within the temperature range. The thermal conductivity is almost constant at 0.44 W/mK and shows only slight increases and decreases of the value.
