Search filter-bitzinger-test - Linseis

STA L81 – Rubber – Decomposition

DIL L75 Vertical CRYO - Copper - Thermal expansion

THB Ultimate (THB L56 Ultimate) – Rubber Compounds – Thermal conductivity

TIM-Tester (TIM L58) – Vespel – Thermal conductivity, Thermal Impedance - Glass Adhesive

TIM-Tester (TIM L58) – Metal sheets with adhesive layer - Thermal Conductivity and Thermal Impedance

STA L81 – Cement sample – STA

TGA L81 – Gypsum plaster decomposition

Chip-DSC 1 (Chip-DSC L66 Basic) – crude oil analysis – wax appearance temperature

Chip-DSC 100 (Chip-DSC L66 Ultimate) – Xerogel nanoparticles

DIL L75 Vertical HT – graphite – Thermal expansion

LFA L52 – Sodium Nitrate – Thermal conductivity

STA HP L84 – Pressure dependent decomposition – High pressure Thermogravimetry

THB Basic/Advanced/Ultimate (THB L56) – Ethanol-water-solution – Thermal conductivity

TFA L59 - thermoelectric thin film - thermoelectric properties - metals and alloys

Chip DSC 1 (Chip-DSC L66 Basic) – Indium melting – Heating rates

LFA L52 – Refractory – Thermal diffusivity

LFA L52 – graphite – Thermal conductivity / thermal diffusivity

LFA L52 – Copper – In-/Trough-Plane – Thermal diffusivity – Thermal Conductivity

LFA L52 – Steel foil – Thermal diffusivity

STA L81 HS – calcium oxalate – high speed inductive STA

Hall system (HCS L36) – Hall coefficient – Inorganics/semiconductors

HCS (HCS L36 Basic/Advanced/Ultimate) – Hall coefficient – Inorganics/semiconductors

HCS (HCS L36 Basic/Advanced/Ultimate) – Hall coefficient – Inorganics/semiconductors

LSR-3 (LSR L31) – Bismuth telluride – Direct ZT measurement of the NIST Bi2Te3

LSR-3 (LSR L31) – Constantan – Seebeck coefficient – Thermoelectric properties

LSR-3 (LSR L31) – Silicon Germanium alloy – Seebeck coefficient/Electrical conductivity

THB Advance/Basic (THB L56) – Phase change material – Thermal conductivity

DIL L75 Vertical – Glass rod – Thermal expansion

DIL L75 Vertical – Quarz – Thermal expansion – calculated DTA

DIL L75 Horizontal – Zirconia – Rate controlled sintering (RCS)

DSC L62 – Thermophysical properties of glasses

HFM L57 – Window Glass – Thermal transmittance – Horizontal vs. Vertical Measurement

LFA L52 – Aluminum oxide Al2O3 – Thermal diffusivity/ conductivity

LFA L52 – BCR 724 – Thermal conductivity / thermal diffusivity

LFA 1000 – Carbide Ceramics – Thermal Conductivity

LFA 1000 – Glass – Thermal diffusivity /Thermal Conductivity /Specific Heat Capacity

Chip-DSC 10 (Chip-DSC L66 Advanced) – DSC of pharmaceuticals – Glass point sorbitol

Chip-DSC 10 (Chip-DSC L66 Advanced) – Food industry – Lactose characterization of glass transitions

Chip-DSC 10 (Chip-DSC L66 Advanced) – food testing with DSC – butter and margarine

Chip-DSC 10 (Chip-DSC L66 Advanced) – foods on DSC – chocolate

STA L82 – Thermal behavior of banana pseudostems

THB Basic/Advanced/Ultimate (THB L56) – Milk powder – Thermal conductivity

Quenching DIL (DIL L78) – Steel rod – Thermal expansion / Deformation

DIL L75 Vertical – Iron – Thermal expansion

LFA L52 – Determination of welding heat source parameters

LFA L52 - Inconel 600 - Thermal diffusivity/thermal conductivity

LFA L52 – copper and aluminum – Thermal diffusivity

LFA L52 – Steel alloys – Thermal conductivity / thermal diffusivity / specific heat

LSR-1 (LSR L32) – Alumel – Absolute Seebeck coefficient

LSR-1 (LSR L32) – Constantan – Seebeck effect

LSR-3 (LSR L31) – Copper – Electric conductivity

STA HP L84 – Heat of Adsorption – HP HDSC

STA L81 – Determination of the melting behaviour of aluminium oxide (Al2O3) in high temperature applications

STA L81 – Melt analysis of palladium

THB Basic (THB L56) – Aluminium Alloy – Thermal conductivity

DIL L75 Horizontal 1600 – Thermal expansion of BNMO and BCZY712

LFA L52 - Thermal diffusivity measurement on Molten Salts

LSR-3 (LSR L31) – Constantan – Seebeck coefficient – Thermoelectric properties

STA HP L84 – Coal gasification – HP STA

STA L82 - Stability of Molten Salts using Simultaneous Thermal Analysis

STA L81 – Titanium hydride – STA

Chip-DSC 10 (Chip-DSC L66 Advanced) – Cp of polymer – modulated cp

Chip-DSC 10 (Chip-DSC L66 Advanced) – Polymers – PET

Chip-DSC 10 (Chip-DSC L66 Advanced) – Polymer sample (PE) – characterization of polymers

Chip-DSC 10 (Chip-DSC L66 Advanced) – Polymer sample (PP) – characterization of polymers

Chip-DSC 10 (Chip-DSC L66 Advanced) – UV curing of polymers – resin curing

Chip-DSC 100 (Chip-DSC L66 Ultimate) – Oxidation of polymer – OIT (oxidation induction time)

Chip-DSC (Chip-DSC L66 Basic) – Polymer sample (ABS) – characterization of polymers

DIL L75 Vertical HT LT – Elastomer – Thermal expansion

HFM L57 – Epoxy – Thermal conductivity

LFA L51 – Polyethylene (PE) – Thermal diffusivity

THB Basic/Advanced/Ultimate (THB L56) – Epoxy – Thermal conductivity

THB Basic/Advanced/Ultimate (THB L56) – Pressed tube material – Thermal conductivity

THB Basic/Advanced/Ultimate (THB L56) – Ceramic filled polymer – Thermal conductivity

TIM-Tester (TIM L58) – Vespel – Thermal conductivity, Thermal Impedance in Polymers

TIM-Tester (TIM L58) – Vespel – Thermal Conductivity

Analysing asphalt with DSC

STA L81 – gypsum sample – TGA+DSC

Thermal analysis of copper fibres

Chip-DSC 1 (Chip-DSC L66 Basic) – Enthalpy of explosives – high energy DSC

LFA L52 - Silicone oils - Thermal conductivity

TFA L59 - thermoelectric thin film - thermoelectric properties - semiconductor

LFA L52 - Multilayer sample - Thermal conductivity

HDSC L62 - Low alloy steel - DSC

TFA L59 - thermoelectric thin film - thermoelectric properties - metals and alloys

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Publications on thermal analysis

TF-LFA L54 - CVD Diamond - Thermal conductivity