Chip-DSC 1

Patented, revolutionary Sensor Concept


On point

The all new Chip-DSC 1 in­te­grates all es­sen­tial parts of DSC: fur­nace, sen­sor and elec­tro­nics in a mi­ni­a­tu­ri­zed hous­ing. The chip-ar­range­ment com­pri­ses the hea­ter and tem­pe­ra­tu­re sen­sor in a che­mi­cally in­ert ce­ra­mic ar­range­ment with me­ta­llic hea­ter and tem­pe­ra­tu­re sen­sor.

This ar­range­ment al­lows su­pe­ri­or re­pro­du­ci­bi­lity and due to the low mass out­stan­ding tem­pe­ra­tu­re con­trol and hea­ting rates of up to 100 K/min. The in­te­gra­ted sen­sor is ea­si­ly user ex­ch­an­ge­a­ble and avai­lable for a low cost.

The integrated design of the chip-sensor delivers superior raw data, which enables a direct analysis without pre- or post-processing of heat flow data.

The compact construction, leads to a significant reduction in production cost which can be passed on to our customers. The low energy consumption and unrivaled dynamic response result in unsurpassed performance of this revolutionary DSC-concept.

Linseis Chip-DSC and apple

Linseis Chip-DSC Sensor

New Chip-Sen­sor Tech­no­lo­gy

Worlds on­ly com­mer­ci­al Heat Flux DSC with in­te­gra­ted hea­ter and tem­pe­ra­tu­re sen­sor. Un­ma­ted sen­si­ti­vi­ty, ti­me con­stant and hea­ting / coo­ling ra­tes.

Highest sensitivity – for detection of melts and weak transitions

The innovative low mass Chip-DSC sensor design enables us to offer a Heat Flux DSC Sensor with unmatched response rate.

Benchmark resolution – precise separation of close lying events

The unique sensor design permits benchmark resolution and perfect separation of overlapping effects.

Unmatched cooling speed – low mass Chip Sensor

Due to the low mass of our sensor we can achieve unmatched cooling speeds, enabling exiting new applications and a higher sample throughput.


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Model Chip-DSC 1*
Temperature range:  RT up to 450 °C
(no cooling option available)
Price range: $
Heating and cooling rates: 0,001 up to 100 K/min
Temperature accuracy: +/- 0,2K
Temperature precision: +/- 0,02K
Digital resolution: 16.8 million points
Resolution: 0,03 µW
Atmospheres: inert, oxidizing (static, dynamic)
Measuring range: +/-2,5 up to +/-1000 mW
Calibration materials: included
Calibration: Recommended 6 month interval

*Specs depend on configurations


The all new Pla­ti­num So­ft­ware greatly en­han­ces your work­flow as the in­tu­i­ti­ve da­ta han­d­ling on­ly re­quires mi­ni­mum pa­ra­me­ter in­put.

AutoEval of­fers a va­lu­a­ble gui­d­an­ce for the user when eva­lu­a­ting stan­dard pro­ces­ses such as glass tran­si­ti­ons or me­l­ting points. The­rmal li­bra­ry pro­duct iden­ti­fi­ca­ti­on tool, pro­vi­des a da­ta­ba­se with 600 po­ly­mers per­mit­ting an au­to­ma­tic iden­ti­fi­ca­ti­on tool for your tes­ted po­ly­mer. In­stru­ment con­trol and/or sur­vei­llan­ce through mo­bi­le de­vi­ces gives you con­trol whe­re­ver you are.

Linseis LFA 500 Software

  • Software packages are compatible with latest Windows operating system
  • Set up menu entries
  • All specific measuring parameters (User, Lab, Sample, Company, etc.)
  • Optional password and user levels
  • Undo and Redo function for all steps
  • Infinite heating, cooling or dwell time segments
  • Multiple language versions such as English, Germany, French, Spanish, Chinese, Japanese, Russian, etc. (user selectable)
  • Evaluation software features a number of functions enabling a complete evaluation of all types of data
  • Multiple smoothing models
  • Complete evaluation history (all steps can be undone)
  • Evaluation and data acquisition can be performed simultaneously
  • Data can be corrected using zero and calibration correction
  • Data evaluation includes: Peak separation software Signal correction and smoothing, first and second derivative, curve arithmetic, data peak evaluation, glass point evaluation, slope correction. Zoom / individual segment display, multiple curve overlay, annotation and drawing tools, copy to clip board function, multiple export features for graphic and data export, reference based correction


Application: Rapid cooling rates without active cooling

The Linseis Chip-DSC allows fastest possible ballistic cooling rates without any active cooler needed. Due to the low thermal mass and innovative sensor design, cooling rates up to 200°C/min from maximum temperature to 100°C and up to 50°C/min from 100°C to room temperature are possible. Starting ballistic cooling from a 400°C isothermal segment, 50°C is reached under 3 min measurement time. Of course, the signal can still be evaluated during that cooling segment and does not lose sensitivity or accuracy.

Chip DSC 10 Application Rapid cooling rates

Application: Measurement of PET granulate

The analysis of polymers is one of the main applications of DSC. Effects like glass transitions, melting and crystallization points are of interest and often very hard to detect. The new Linseis Chip-DSC provides high resolution and sensitivity, making it an ideal instrument for this kind of analysis. As an example, a PET granulate was heated, quench cooled to freeze the amorphous state and afterwards measured by Chip-DSC with a linear heating rate of 50°C/min. The curve shows a significant glass transition around 80°C, followed by a cold crystallization of the amorphous parts starting at 148°C and a melting peak at 230,6°C.

Chip DSC PET Sample 2


Webinar Product presentation
Installation of the Chip-DSC
Sensor exchange
Measurement of PET