Search filter-bitzinger-test - Linseis

STA L81 – Rubber – Decomposition

DIL L75 Vertical CRYO - Copper - Thermal expansion

THB Ultimate (THB L56 Ultimate) – Rubber Compounds – Thermal conductivity

TIM-Tester (TIM L58) – Vespel – Thermal conductivity, Thermal Impedance - Glass Adhesive

TIM-Tester (TIM L58) – Metal sheets with adhesive layer - Thermal Conductivity and Thermal Impedance

STA L81 – Cement sample – STA

TGA L81 – Gypsum plaster decomposition

Chip-DSC 1 (Chip-DSC L66 Basic) – crude oil analysis – wax appearance temperature

Chip-DSC 100 (Chip-DSC L66 Ultimate) – Xerogel nanoparticles

DIL L75 Vertical HT – graphite – Thermal expansion

LFA L52 – Sodium Nitrate – Thermal conductivity

STA HP L84 – Pressure dependent decomposition – High pressure Thermogravimetry

THB Basic/Advanced/Ultimate (THB L56) – Ethanol-water-solution – Thermal conductivity

TFA L59 - thermoelectric thin film - thermoelectric properties - metals and alloys

Chip DSC 1 (Chip-DSC L66 Basic) – Indium melting – Heating rates

LFA L52 – Refractory – Thermal diffusivity

LFA L52 – graphite – Thermal conductivity / thermal diffusivity

LFA L52 – Copper – In-/Trough-Plane – Thermal diffusivity – Thermal Conductivity

LFA L52 – Steel foil – Thermal diffusivity

STA L81 HS – calcium oxalate – high speed inductive STA

Hall system (HCS L36) – Hall coefficient – Inorganics/semiconductors

HCS (HCS L36 Basic/Advanced/Ultimate) – Hall coefficient – Inorganics/semiconductors

HCS (HCS L36 Basic/Advanced/Ultimate) – Hall coefficient – Inorganics/semiconductors

LSR-3 (LSR L31) – Bismuth telluride – Direct ZT measurement of the NIST Bi2Te3

LSR-3 (LSR L31) – Constantan – Seebeck coefficient – Thermoelectric properties

LSR-3 (LSR L31) – Silicon Germanium alloy – Seebeck coefficient/Electrical conductivity

THB Advance/Basic (THB L56) – Phase change material – Thermal conductivity

DIL L75 Vertical – Glass rod – Thermal expansion

DIL L75 Vertical – Quarz – Thermal expansion – calculated DTA

DIL L75 Horizontal – Zirconia – Rate controlled sintering (RCS)

DSC L62 – Thermophysical properties of glasses

HFM L57 – Window Glass – Thermal transmittance – Horizontal vs. Vertical Measurement

LFA L52 – Aluminum oxide Al2O3 – Thermal diffusivity/ conductivity

LFA L52 – BCR 724 – Thermal conductivity / thermal diffusivity

LFA 1000 – Carbide Ceramics – Thermal Conductivity

LFA 1000 – Glass – Thermal diffusivity /Thermal Conductivity /Specific Heat Capacity

Chip-DSC 10 (Chip-DSC L66 Advanced) – DSC of pharmaceuticals – Glass point sorbitol

Chip-DSC 10 (Chip-DSC L66 Advanced) – Food industry – Lactose characterization of glass transitions

Chip-DSC 10 (Chip-DSC L66 Advanced) – food testing with DSC – butter and margarine

Chip-DSC 10 (Chip-DSC L66 Advanced) – foods on DSC – chocolate

STA L82 – Thermal behavior of banana pseudostems

THB Basic/Advanced/Ultimate (THB L56) – Milk powder – Thermal conductivity

Quenching DIL (DIL L78) – Steel rod – Thermal expansion / Deformation

DIL L75 Vertical – Iron – Thermal expansion

LFA L52 – Determination of welding heat source parameters

LFA L52 - Inconel 600 - Thermal diffusivity/thermal conductivity

LFA L52 – copper and aluminum – Thermal diffusivity

LFA L52 – Steel alloys – Thermal conductivity / thermal diffusivity / specific heat

LSR-1 (LSR L32) – Alumel – Absolute Seebeck coefficient

LSR-1 (LSR L32) – Constantan – Seebeck effect

LSR-3 (LSR L31) – Copper – Electric conductivity

STA HP L84 – Heat of Adsorption – HP HDSC

STA L81 – Determination of the melting behaviour of aluminium oxide (Al2O3) in high temperature applications

STA L81 – Melt analysis of palladium

THB Basic (THB L56) – Aluminium Alloy – Thermal conductivity

DIL L75 Horizontal 1600 – Thermal expansion of BNMO and BCZY712

LFA L52 - Thermal diffusivity measurement on Molten Salts

LSR-3 (LSR L31) – Constantan – Seebeck coefficient – Thermoelectric properties

STA HP L84 – Coal gasification – HP STA

STA L82 - Stability of Molten Salts using Simultaneous Thermal Analysis

STA L81 – Titanium hydride – STA

Chip-DSC 10 (Chip-DSC L66 Advanced) – Cp of polymer – modulated cp

Chip-DSC 10 (Chip-DSC L66 Advanced) – Polymers – PET

Chip-DSC 10 (Chip-DSC L66 Advanced) – Polymer sample (PE) – characterization of polymers

Chip-DSC 10 (Chip-DSC L66 Advanced) – Polymer sample (PP) – characterization of polymers

Chip-DSC 10 (Chip-DSC L66 Advanced) – UV curing of polymers – resin curing

Chip-DSC 100 (Chip-DSC L66 Ultimate) – Oxidation of polymer – OIT (oxidation induction time)

Chip-DSC (Chip-DSC L66 Basic) – Polymer sample (ABS) – characterization of polymers

DIL L75 Vertical HT LT – Elastomer – Thermal expansion

HFM L57 – Epoxy – Thermal conductivity

LFA L51 – Polyethylene (PE) – Thermal diffusivity

THB Basic/Advanced/Ultimate (THB L56) – Epoxy – Thermal conductivity

THB Basic/Advanced/Ultimate (THB L56) – Pressed tube material – Thermal conductivity

THB Basic/Advanced/Ultimate (THB L56) – Ceramic filled polymer – Thermal conductivity

TIM-Tester (TIM L58) – Vespel – Thermal conductivity, Thermal Impedance in Polymers

TIM-Tester (TIM L58) – Vespel – Thermal Conductivity

Analysing asphalt with DSC

STA L81 – gypsum sample – TGA+DSC

Thermal analysis of copper fibres

Chip-DSC 1 (Chip-DSC L66 Basic) – Enthalpy of explosives – high energy DSC

LFA L52 - Silicone oils - Thermal conductivity

TFA L59 - thermoelectric thin film - thermoelectric properties - semiconductor

LFA L52 - Multilayer sample - Thermal conductivity

HDSC L62 - Low alloy steel - DSC

TFA L59 - thermoelectric thin film - thermoelectric properties - metals and alloys

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Publications on thermal analysis

TF-LFA L54 - CVD Diamond - Thermal conductivity

USA

Linseis Inc.
109 North Gold Drive
Robbinsville, NJ 08691

Europe

Linseis Messgeraete GmbH
Vielitzerstr. 43
95100 Selb / Germany

China

Linseis Shanghai Scientific
Room 120, Building T3, No.1220 Yuqiao Road, Pudong, Shanghai

India

Linseis Thermal Analysis India Pvt. Ltd.
Plot 65, 2nd Floor, Sai Enclave,
Sector 23, Dwarka, 110077 New Delhi