Testing of Vespel for thermal conductivity and thermal impedance. The glass adhesive under investigation is used for structural bonding and, in particular, for sealing glass in vehicles.
The adhesive offers a wide range of mechanical properties, making it suitable for sealing and filling gaps in automotive batteries, as well as for side windows, modular roof structures, sunroof systems, and door windows.
Its beneficial properties include high thermal conductivity, low thermal resistance, and vibration damping, and it is compatible with all vehicle production processes. The purpose of the measurement using the TIM tester was to verify its thermal conductivity.
The graph shows a measurement of the thermal impedance (thermal conductivity) of the adhesive at 37 °C with a specified temperature gradient of 6 °C.
During the measurement, the pressure was increased to achieve greater compression of the sample. The thickness decreased from 3 mm to 2 mm.
The thermal conductivity was determined to be 1.76 W/mK, which is in line with expectations.
