TIM L58: Thermal Interface Material Tester for advanced TIM characterization
Unique Features
Advanced Pressure & Measurement Control
The TIM L58 combines precise force regulation, automatic thickness determination and highly stable thermal control for reliable TIM characterization under realistic operating conditions.
The advantages of the integrated measurement platform include:
Exchangeable Meter Bar System
Modular meter bars enable fast adaptation to different TIMs, with automatic storage of calibration and geometry dataIntegrated thickness determination
Continuous LVDT-based thickness measurement during operationHigh measurement reproducibility
Delivers stable and reliable thermal resistance dataASTM D5470 compliant testing
Standardized and comparable TIM characterization
Advanced Measurement Electronics
The integrated measurement electronics of the TIM L58 provide highly stable and reproducible thermal interface characterization under realistic operating conditions.
The advantages of the advanced measurement architecture include:
Minimization of measurement drift
Ensures stable long-term thermal resistance measurementsPrecise thickness determination
High-resolution LVDT measurement for accurate TIM evaluationHighest measurement accuracy
Increases reliability of thermal impedance and conductivity dataExcellent reproducibility
Guarantees consistent results during repeated measurements and cycle testing
LiEAP Software Platform
The TIM L58 is fully integrated into the LINSEIS Evaluation and Acquisition Platform (LiEAP), providing intuitive device control, synchronized data acquisition and advanced thermal analysis in one unified software environment.
Linseis Lab Link
With Linseis Lab Link, we offer an integrated solution for eliminating uncertainties in measurement results. With direct access to our application experts via the software, you receive advice on the correct measurement procedure and how to evaluate the results. This direct communication ensures optimal results and maximizes the efficiency of your measurements for accurate analysis and research and a smooth process flow.
Software improvements
Lex Bus Plug & Play
Our latest hardware interface Lex Bus revolutionizes data communication within our systems.
Lex Bus enables the seamless and efficient integration of new hardware and software tools.Improved furnace control
Our new and further optimized oven control system allows even more precise temperature control.
The result: more precise temperature control – exactly according to your wishes and requirements – and therefore better measurement results.New software with user interface
Our communication is now even more focused on your needs:
You are always informed about the current status and receive targeted support whenever it is needed.Process reliability
Our software has been optimized for maximum process security: Your data is protected at all times and can be processed in a fail-safe manner.Error messages and bug fixes
The system automatically detects errors and problems, documents them immediately and fixes them as quickly as possible – for minimal downtime.Automatic updates and new functions
Regular automatic software updates not only improve security, but also continuously bring new functions.Permanent system monitoring
The software permanently monitors all system parameters – for optimum performance at all times.Preventive maintenance and problem detection
Our preventive maintenance approach detects problems and wear at an early stage, before damage occurs – to keep your appliance in top form for the long term.
Automatic Pressure Control
The integrated electromechanical pressure system enables precise and reproducible contact force regulation up to 16 MPa for realistic TIM characterization under application-relevant conditions.
Integrated Thickness Determination
A high-resolution LVDT system continuously measures the sample thickness during operation, ensuring highly accurate thermal resistance and conductivity calculations.
Highlights
Automatic pressure control up to 16 MPa
ASTM D5470 compliant measurements
Exchangeable meter bar system
Fully integrated LiEAP software platform
Temperature range from -30 °C to 450 °C
Integrated LVDT thickness measurement
Key Features
Wide temperature range
-30 °C to 450 °C – The LINSEIS TIM L58 enables precise characterization of thermal interface materials under realistic operating conditions across one of the widest temperature ranges available for TIM testing.
Automatic pressure control
Up to 16 MPa – The integrated electromechanical actuator enables highly reproducible contact pressure conditions for realistic TIM characterization.
Temperature cycling & reliability testing
Automated cycling functions enable investigation of TIM aging, pump-out effects and long-term thermal stability.
Integrated LINSEIS platform
The integrated LINSEIS software offers a comprehensive solution that combines hardware and software for maximum process reliability and precision. The standardized platform enables seamless integration of components and devices from external partners – for a particularly robust and reliable overall system.
Questions? We're just a call away!
+1 (609) 223 2070
+49 (0) 9287/880 0
Our service is available Monday to
Thursday from 8-16 o’clock
and Friday from 8-12 o’clock.
We are here for you!
Specifications
Thermal Conductivity Range: 0.1 to 50 W/mK
Temperature range: -30°C to 450°C
Thickness Control: ± 5 µm
Discover our high-performance TIM tester – developed for reliable and realistic thermal interface characterization:
Sample thickness: 0.001 to 8 mm (up to 20 mm optional)
Sample resistance range: 0.005 – 500 cm²K/W
Force options: 1 kN, 2 kN and 5 kN
Material compatibility: Pastes, pads, foils, polymers, graphite, metals and ceramics
Temperature cycling: Automated reliability and aging investigations under realistic operating conditions
Method
Steady-State Thermal Interface Material Testing according to ASTM D5470
Thermal Interface Material (TIM) testing measures the thermal resistance and heat transfer performance of materials placed between two contacting surfaces under defined mechanical and thermal conditions. The method provides direct insight into the efficiency of heat transport across interfaces – a critical parameter for modern electronics, battery systems and power devices.
During a TIM measurement, the sample is positioned between a heated upper meter bar and a cooled lower meter bar. A defined heat flow is generated through the material while the contact pressure is precisely controlled. The resulting temperature gradient across the sample is continuously recorded and used to calculate the thermal resistance and apparent thermal conductivity.
Unlike conventional bulk thermal conductivity methods, TIM testing specifically evaluates the complete interface performance under realistic mounting conditions. This includes the influence of contact pressure, sample thickness, surface conformity and interface quality on the overall thermal behavior.
The integrated thickness determination system simultaneously measures the effective sample thickness during operation, ensuring highly accurate and reproducible calculations even for soft or compressible TIM materials such as thermal pastes, pads and foils.
TIM characterization according to ASTM D5470 is indispensable for the development of advanced thermal management solutions. It supports reliable evaluation of thermal interface materials for semiconductor cooling, battery technology, automotive electronics and high-performance industrial applications.
Measured variables with TIM characterization
Possibilities of thermal interface material analysis using the TIM L58:
- Thermal resistance
- Apparent thermal conductivity
- Thermal impedance
- Contact resistance
- Pressure-dependent thermal behavior
- Temperature-dependent thermal behavior
- Thickness-dependent thermal performance
- Heat flow through the interface
- Aging and cycling stability
- Compression-dependent material behavior
A head start with the TIM L58 - flexible options for every need
Questions? We're just a call away!
+1 (609) 223 2070
+49 (0) 9287/880 0
Our service is available Monday to
Thursday from 8-16 o’clock
and Friday from 8-12 o’clock.
We are here for you!
TIM L58 explained - function, use, features and frequently asked questions
What is a thermal interface material (TIM)?
Thermal interface materials (TIMs) are materials placed between two contacting surfaces to improve heat transfer and reduce thermal contact resistance. Typical TIMs include thermal greases, pads, foils, phase change materials and graphite sheets used in electronics, batteries and power modules.
Which materials can be measured with the TIM L58?
The TIM L58 supports characterization of a wide range of materials including thermal pastes, pads, foils, graphite materials, polymers, metals, ceramics and phase change materials (PCM). The system is designed for both soft and solid interface materials.
What is measured according to ASTM D5470?
ASTM D5470 describes a standardized steady-state heat flow method for determining the thermal resistance and apparent thermal conductivity of thermal interface materials. The TIM L58 performs these measurements under controlled temperature and pressure conditions for highly reproducible results.
How does contact pressure influence TIM performance?
Contact pressure significantly affects the thermal performance of interface materials. Increasing pressure can reduce air gaps and improve surface conformity, resulting in lower thermal resistance and improved heat transfer. The TIM L58 enables precise investigation of pressure-dependent thermal behavior.
Can the TIM L58 perform temperature cycling and aging tests?
Yes. The TIM L58 supports automated temperature cycling and long-term stability investigations. This enables evaluation of material aging, pump-out effects and thermal reliability under realistic operating conditions.
What does an TIM L58 cost?
The price of a TIM L58 system depends on the selected configuration and optional features, such as the temperature range, force configuration, cooling system, exchangeable meter bars or software extensions for temperature cycling and reliability testing. As each system can be tailored to specific application requirements, the final configuration and pricing may vary.
For an exact quotation, please use our contact form and provide your application details – our team will be happy to prepare a customized solution for your requirements.
How long is the delivery time for an TIM L58?
The delivery time for a TIM L58 system depends on the selected configuration and optional features. Additional options such as extended temperature ranges, customized meter bars, cooling systems or advanced software packages for temperature cycling and reliability testing may increase production and preparation time.
Please contact us via our contact form to receive a precise delivery time estimate based on your specific application and configuration requirements.
What is the difference between thermal resistance and thermal conductivity?
Thermal conductivity describes the intrinsic ability of a material to conduct heat, while thermal resistance reflects the actual resistance against heat flow within a complete interface system. TIM testing considers not only the material itself, but also thickness, contact pressure and interface quality.
Software
Making values visible and comparable
All LINSEIS thermoanalytical devices are software-controlled. The individual software modules run exclusively under Microsoft® Windows® operating systems. The complete software consists of 3 modules: temperature control, data acquisition and data evaluation. The Windows® software contains all the essential functions for preparing, carrying out and evaluating a thermoanalytical measurement. Thanks to our specialists and application experts, LINSEIS was able to develop a comprehensive, easy-to-understand and user-friendly software.
General Functions
- Real-time measurement visualization
- Freely configurable graph layouts and axis scaling
- Automatic and manual scaling functions
- Zoom and cursor tools
- Curve comparison and overlay functions
- Statistical evaluation tools
- Automatic report generation
- Data export to Excel® and ASCII formats
- Multi-user operation
- Data security in case of power failure
- Automatic calibration routines
- Storage and export of evaluation results
- Integrated online help system
- First and second derivative calculations
- Flexible data processing and post-analysis
Thermal Analysis Functions
- Automatic thermal resistance calculation
- Apparent thermal conductivity determination
- Thermal impedance evaluation
- Contact resistance calculation
- Thickness-dependent thermal analysis
- Pressure-dependent thermal performance evaluation
- Temperature-dependent material characterization
Advanced Testing Functions
- Automated temperature cycling measurements
- Reliability and aging investigations
- Long-term stability testing
- Multi-step measurement sequences
- Automated measurement workflows
- Batch testing capabilities
System Control
- Independent upper and lower temperature control
- Automatic force regulation and monitoring
- Continuous thickness monitoring via LVDT
- Real-time measurement status display
- Automated test sequence execution
Quality & Validation Tools
- Quality management plugin
- Repeatability verification
- Statistical comparison of measurement series
- Calibration management
- Standardized ASTM D5470 evaluation routines
LINSEIS Thermal Library
The LINSEIS Thermal Library software package is an option for the well-known, user-friendly LINSEIS Platinum evaluation software, which is integrated in almost all our devices. The Thermal Library allows you to compare the complete curves with a database containing thousands of references and standard materials in just 1-2 seconds.
Multi-instrument
All LINSEIS instruments TIM, DSC, DIL, STA, HFM, LFA, etc. can be controlled via a software template.
Multilingual
Our software is available in many different user-interchangeable languages, such as: English, Spanish, French, German, Chinese, Korean, Japanese, etc.
Report generator
Convenient template selection for creating individual measurement reports.
Multi-user
The administrator can set up different user levels with different rights to operate the device. An optional log file is also available.
Kinetic software
Kinetic analysis of DSC, DTA, TGA, EGA (TG-MS, TG-FTIR) data to investigate the thermal behavior of raw materials and products.
Database
The state-of-the-art database enables simple data management with up to 1000 data records.
Applications
Semiconductors & Electronics
Thermal interface materials in power electronics, CPUs, GPUs and electronic modules are exposed to continuous thermal and mechanical cycling during operation. The TIM L58 enables reliability and aging studies under cyclic temperature and compression conditions, allowing prediction of long-term thermal performance and service life.
Application example: Cycle Testing and Thermal Resistance
Aging studies and behavior under continuous stress are important
tests for understanding the long-term performance of TIM
materials. For this characterization, the TIM Tester (TIM L58)
offers a software plug-in that can be used to cyclically change
either the temperature or the gap distance or compression. During
the cycle, all properties such as temperature, gap distance/
sample thickness, pressure, and thermal impedance are continuously
monitored to directly detect changes in behavior.
The upper application shows that in the performance test, a cyclic
compression of ± 30 μm with a frequency of 0.02 Hz was defined
at a constant sample temperature. The first image shows this cycle
with the nominal and live tracked gap distance. The second image
shows that the thermal impedance increases slightly with the number of cycles, resulting in slightly lower performance during
long-term use. This information helps in modeling devices and
estimating the service life of individual parts.
Application: Temperature dependent measurement of thermal conductive pads
Measurement of the thermal impedance (thermal conductivity) of a 25mm x 25mm thermal conductive pad (sample type 2) at 50°C (TH=70°C, TC=30°C). Three different samples with a thickness between 2.01 mm and 3.02 mm have been measured in order to determine the thermal contact resistance (using linear regression).
Application: Possible sample types
Type I
Viscous liquids that exhibit unlimited deformation when a stress is applied. These include liquid compounds such as greases, pastes, and phase change materials. These materials exhibit no evidence of elastic behavior or the tendency to return to initial shape after deflection stresses are removed.
Type II
Viscoelastic solids where stresses of deformation are ultimately balanced by internal material stresses thus limiting further deformation. Examples include gels, soft, and hard rubbers. These materials exhibit linear elastic properties with significant deflection relative to material thickness.
Type III
Elastic solids which exhibit negligible deflection. Examples include ceramics, metals, and some types of plastics.
Application example: Measurement of type 1 viscous thermal paste (at 60 °C)
Measurement of the thermal impedance (effective thermal conductivity) of a viscous thermal paste (sample type 1)
at 60 °C. Several samples with nominal thicknesses between 0.25 mm and 1.50 mm were analyzed to quantify the temperature gradient and resulting thermal impedance under zero-pressure conditions.
Automotive & Aerospace
Thermal Interface Materials (TIMs) are essential components in automotive and aerospace systems, where efficient heat dissipation is critical for performance, reliability and lifetime. They improve heat transfer between power electronics, batteries, cooling systems and structural components by minimizing thermal contact resistance at interfaces.
The TIM L58 enables precise characterization of thermal conductivity, thermal resistance and interface performance under realistic temperature and pressure conditions. This supports the development and optimization of thermal management solutions for electric vehicles, battery systems, avionics, radar
Application: Measurement of Vespel™ (at 50°C, 1MPa)
Measurement of the thermal impedance (thermal conductivity) of a 25mm x 25mm Vespel™ sample at 50°C (TH=70°C, TC=30°C) and a contact pressure of 1 MPa. Three different samples with a thickness between 1,1 mm and 3,08 mm have been measured in order to determine the apparent thermal conductivity and thermal contact resistance (using linear regression).
Application: Temperature dependent measurement of Vespel™
Plot of the temperature dependent apparent thermal conductivity of a 25mm x 25mm Vespel™ sample between 40°C and 150°C and a constant contact pressure of 1 MPa.
Well informed
