TIM L58: Test device for thermally conductive materials for detailed characterization of TIM
The LINSEIS TIM L58 is a high-end system for the precise characterization of thermally conductive materials (TIMs) under realistic contact pressure and temperature conditions. The device enables the precise determination of the thermal impedance and apparent thermal conductivity in accordance with the ASTM D5470 standard. The TIM L58 was developed for applications in the fields of electronics, battery technology, semiconductor cooling and advanced thermal management and supports the analysis of viscous TIM-pastes, pads, films, polymers and metallic interface materials. With automatic pressure control up to 16 MPa, integrated thickness determination and a temperature range of -30 °C to 450 °C, the system offers outstanding flexibility, reproducibility and precision to industry standards.
Unique features
Advanced pressure and measurement control
The TIM L58 combines precise force control, automatic thickness determination and highly stable temperature control for reliable TIM characterization under realistic operating conditions.
The advantages of the integrated measuring platform include
- NEW: Exchangeable meter bars
Modular meter bars enable quick adaptation to different TIMs with automatic storage of calibration and geometry data - Integrated thickness determination
Continuous LVDT-based thickness measurement during operation - High measurement reproducibility
Provides stable and reliable thermal resistance data - ASTM D5470-compliant testing
Standardized and comparable TIM characterization
Sophisticated measuring electronics
The integrated measurement electronics of the TIM L58 enable extremely stable and reproducible characterization of heat conducting materials under realistic operating conditions.
The advantages of the advanced measurement architecture include
- Minimizes measurement drift
Ensures stable long-term measurements of thermal resistance - Precise determination of thickness
High-resolution LVDT measurement for an accurate assessment of the TIM - Highest measurement accuracy
Increases the reliability of thermal impedance and conductivity data - Excellent reproducibility
Guarantees consistent results with repeated measurements and cycle tests
LiEAP Software Platform
The TIM L58 is fully integrated into the LINSEIS Evaluation and Acquisition Platform (LiEAP) and offers intuitive device control, synchronized data acquisition and advanced thermal analysis in a unified software environment.
Linseis Lab Link
With Linseis Lab Link, we offer an integrated solution for eliminating uncertainties in measurement results. Through direct contact with our application experts via the software, you receive advice on the correct measurement procedure and how to evaluate the results. This direct communication ensures optimal results and maximizes the efficiency of your measurements – for precise analyses and research work as well as a smooth workflow.
Software improvements
- Lex Bus Plug & Play
Our latest hardware interface Lex Bus revolutionizes data communication within our systems. Lex Bus enables the seamless and efficient integration of new hardware and software tools. - Improved oven control
Our new and further optimized oven control system enables even more precise temperature control. The result: more precise temperature control – exactly according to your wishes and requirements – and therefore better measurement results. - New software with user interface
Our communication is now even more focused on your needs: You are always informed about the current status and receive targeted support if required. - Process reliability
Our software has been optimized for maximum process security: Your data is protected at all times and can be processed in a fail-safe manner. - Error messages and troubleshooting
The system automatically detects errors and problems, documents them immediately and rectifies them as quickly as possible – for minimal downtime. - Automatic updates and new functions
Regular automatic software updates not only improve security, but also continuously bring new functions. - Permanent system monitoring
The software permanently monitors all system parameters – for optimum performance at all times. - Preventive maintenance and problem detection
Our preventive maintenance approach detects problems and wear at an early stage before damage occurs – to keep your appliance in top form in the long term.
Automatic pressure control
The integrated electromechanical pressure system enables precise and reproducible control of the contact pressure up to 16 MPa for realistic characterization of TIM under application-relevant conditions.
Integrated thickness measurement
A high-resolution LVDT system continuously measures the sample thickness during operation, ensuring extremely accurate calculations of thermal resistance and thermal conductivity.
Highlights
Automatic pressure control up to 16 MPa
Measurements according to ASTM D5470
System with exchangeable meter bars
Fully integrated LiEAP software platform
Temperature range from -30 °C to 450 °C
Integrated LVDT thickness measurement
Key features
Wide temperature range
-30 °C to 450 °C – The LINSEIS TIM L58 enables the precise characterization of thermally conductive materials under realistic operating conditions over one of the largest temperature ranges available for TIM tests.
Automatic pressure control
Up to 16 MPa – The integrated electromechanical actuator enables highly reproducible contact pressure conditions for realistic TIM characterization.
Exchangeable meter bars
The modular meter-bar system enables optimum adaptation to different TIM materials and thermal conductivity ranges. Interchangeable measuring blocks ensure maximum flexibility and maximum measuring accuracy for a wide range of applications.
Integrated LINSEIS platform
The integrated LINSEIS software offers a comprehensive solution that combines hardware and software for maximum process reliability and precision. The standardized platform enables the seamless integration of components and devices from external partners – for a particularly robust and reliable overall system.
Questions? Just give us a call!
+1 (609) 223 2070
+49 (0) 9287/880 0
Thursday from 8 am to 4 pm
and Friday from 8 am to 12 pm.
We are here for you!
Specifications
Thermal conductivity range: 0.1 to 50 W/mK
Temperature range: -30°C to 450°C
Thickness control± 5 µm
Discover our powerful TIM tester – designed for reliable and realistic characterization of thermally conductive materials:
- Sample thickness: 0.001 to 8 mm (optionally up to 20 mm)
- Resistance range of the sample: 0.005 – 500 cm²K/W
- Force options: 1 kN, 2 kN and 5 kN
- Material compatibility: pastes, pads, foils, polymers, graphite, metals and ceramics
- Temperature cycles: Automated reliability and ageing tests under realistic operating conditions
Method
Steady-State Thermal Interface Material Testing according to ASTM D5470
Thermal interface testing (TIM) measures the thermal resistance and heat transfer performance of materials placed between two contact surfaces under defined mechanical and thermal conditions. The method provides direct insights into the efficiency of heat transfer across interfaces – a crucial parameter for modern electronics, battery systems and power components.
In a TIM measurement, the sample is positioned between a heated upper measuring strip and a cooled lower measuring strip. A defined heat flow is generated through the material while the contact pressure is precisely controlled. The resulting temperature gradient across the sample is continuously recorded and used to calculate the thermal resistance and apparent thermal conductivity.
In contrast to conventional methods for measuring bulk thermal conductivity, the TIM test specifically evaluates the overall interface performance under realistic installation conditions. This includes the influence of contact pressure, specimen thickness, surface properties and interface quality on the overall thermal behavior.
The integrated thickness measurement system simultaneously measures the effective sample thickness during operation, ensuring highly accurate and reproducible calculations, even with soft or compressible TIM materials such as thermal pastes, pads and foils.
TIM characterization according to ASTM D5470 is essential for the development of advanced thermal management solutions. It supports the reliable evaluation of thermal interface materials for semiconductor cooling, battery technology, automotive electronics and high-performance industrial applications.
Measured variables with TIM characterization
Possibilities of analyzing heat conducting materials with the TIM L58:
- Thermal resistance
- Apparent thermal conductivity
- Thermal impedance
- Contact resistance
- Pressure-dependent thermal behavior
- Temperature-dependent thermal behavior
- Thickness-dependent thermal output
- Heat flow through the interface
- Aging and cycle stability
- Pressure-dependent material behavior
A head start with the TIM L58 - flexible options for every need
Questions? Just give us a call!
+1 (609) 223 2070
+49 (0) 9287/880 0
Thursday from 8 am to 4 pm
and Friday from 8 am to 12 pm.
We are here for you!
TIM L58 at a glance - function, application, features and frequently asked questions
What is a thermal interface material (TIM)?
Thermally conductive materials (TIMs) are materials that are placed between two contact surfaces to improve heat transfer and reduce thermal contact resistance. Typical TIMs include thermal pastes, thermal pads, thermal foils, phase change materials and graphite plates, which are used in electronics, batteries and power modules.
Which materials can be measured with the TIM L58?
The TIM L58 enables the characterization of a wide range of materials, including thermal pastes, contact pads, foils, graphite materials, polymers, metals, ceramics and phase change materials (PCM). The system is designed for both soft and solid interface materials.
What is measured according to ASTM D5470?
The ASTM D5470 standard describes a standardized method for measuring steady-state heat flow to determine the thermal resistance and apparent thermal conductivity of thermally conductive materials. The TIM L58 device performs these measurements under controlled temperature and pressure conditions to achieve highly reproducible results.
How does the contact pressure affect the performance of the heat conducting material?
The contact pressure has a significant influence on the thermal properties of heat conducting materials. By increasing the pressure, air gaps can be reduced and the surface adaptation improved, resulting in lower thermal resistance and better heat transfer. With the TIM L58, the pressure-dependent thermal behavior can be precisely investigated.
Can the TIM L58 perform thermal shock and ageing tests?
Yes, the TIM L58 supports automated temperature cycles and long-term stability tests. This enables the evaluation of material ageing, pump-out effects and thermal reliability under realistic operating conditions.
What does a TIM L58 cost?
The price of a TIM L58 system depends on the chosen configuration and optional features, such as temperature range, force configuration, cooling system, interchangeable measurement rails or software extensions for thermal cycling and reliability testing. As each system can be tailored to specific application requirements, the final configuration and price may vary.
For an exact quote, please use our contact form and provide your application details – our team will be happy to create a customized solution for your requirements.
How long is the delivery time for a TIM L58?
The delivery time for a TIM L58 system depends on the selected configuration and optional features. Additional options such as extended temperature ranges, customized measuring bars, cooling systems or advanced software packages for thermal cycling and reliability testing may increase production and preparation time.
Please contact us via our contact form to receive an exact delivery time quote based on your specific application and configuration requirements.
What is the difference between thermal resistance and thermal conductivity?
Thermal conductivity describes the inherent ability of a material to conduct heat, while thermal resistance reflects the actual resistance to heat flow within an entire interface system. When testing thermally conductive pastes, not only the material itself is taken into account, but also the thickness, contact pressure and quality of the interface.
Software
Making values visible and comparable
All LINSEIS thermoanalytical devices are software-controlled. The individual software modules run exclusively under Microsoft® Windows® operating systems. The complete software consists of three modules: temperature control, data acquisition and data evaluation. The Windows® software contains all the essential functions for preparing, performing and evaluating a thermoanalytical measurement. Thanks to our specialists and application experts, LINSEIS has been able to develop comprehensive, easy-to-understand and user-friendly software.
General functions
- Real-time visualization of the measurement data
- Freely configurable diagram layouts and axis scaling
- Automatic and manual scaling functions
- Zoom and cursor tools
- Curve comparison and overlay functions
- Statistical evaluation tools
- Automatic report generation
- Data export to Excel® and ASCII formats
- Multi-user operation
- Data security in the event of a power failure
- Automatic calibration routines
- Storage and export of evaluation results
- Integrated online help system
- Calculations of the first and second derivative
- Flexible data processing and post analysis
Functions for thermal analysis
- Automatic calculation of the thermal resistance
- Determination of the apparent thermal conductivity
- Evaluation of the thermal impedance
- Calculation of the contact resistance
- Thickness-dependent thermal analysis
- Evaluation of the pressure-dependent thermal behavior
- Temperature-dependent material characterization
Extended test functions
- Automated temperature change measurements
- Reliability and ageing tests
- Long-term stability tests
- Multi-stage measurement sequences
- Automated measurement sequences
- Functions for batch tests
System control
- Independent control of upper and lower temperature
- Automatic force control and monitoring
- Continuous thickness monitoring using LVDT
- Real-time display of the measurement status
- Automated execution of test sequences
Quality and validation tools
- Plugin for quality management
- Checking the repeatability
- Statistical comparison of measurement series
- Calibration management
- Standardized evaluation routines according to ASTM D5470
LINSEIS Thermal Library
The “LINSEIS Thermal Library” software package is an option for the well-known, user-friendly LINSEIS Platinum evaluation software, which is integrated in almost all of our devices. With the Thermal Library, you can compare the complete curves with a database containing thousands of reference and standard materials in just 1-2 seconds.
Multi-instrument
All LINSEIS devices – TIM, DSC, DIL, STA, HFM, LFA etc. – can be controlled via a software template.
Multilingual
Our software is available in many different languages that can be selected by the user, including: English, Spanish, French, German, Chinese, Korean, Japanese, etc.
Report generator
Practical template selection for creating individual measurement reports.
Multi-user operation
The administrator can set up different user levels with different rights for operating the device. An optional log file is also available.
Kinetic software
Kinetic analysis of DSC, DTA, TGA and EGA data (TG-MS, TG-FTIR) to investigate the thermal behavior of raw materials and products.
Database
The state-of-the-art database enables simple data management with up to 1000 data records.
Application
Semiconductors & Electronics
Thermal interface materials in power electronics, CPUs, GPUs and electronic modules are exposed to constant thermal and mechanical cycling stresses during operation. The TIM L58 enables reliability and ageing tests under cyclic temperature and pressure conditions and thus enables the prediction of long-term thermal performance and service life.
Application example: Cycle tests and thermal resistance
Ageing tests and the behavior under continuous load are important tests for understanding the long-term performance of TIM materials. For this characterization, the TIM tester (TIM L58) offers a software plug-in that allows either the temperature, gap distance or compression to be changed cyclically. During the cycle, all properties such as temperature, gap distance/sample thickness, pressure and thermal impedance are continuously monitored in order to directly record changes in behavior. The figure above shows that a cyclic compression of ± 30 μm with a frequency of 0.02 Hz at a constant sample temperature was defined in the performance test. The first image shows this cycle with the nominal and the live recorded gap distance. The second image shows that the thermal impedance increases slightly with the number of cycles, resulting in a slightly lower performance in long-term operation. This information helps with the modeling of components and the estimation of the service life of individual components.
Application: Temperature-dependent measurement of heat conducting pads
Measurement of the thermal impedance (thermal conductivity) of a 25 mm x 25 mm thermal pad (sample type 2) at 50 °C (TH = 70 °C, TC = 30 °C). Three different samples with a thickness between 2.01 mm and 3.02 mm were measured to determine the thermal contact resistance (using linear regression).
Application: Possible sample types
Type I
Viscous liquids that exhibit unlimited deformation under load. These include liquid compounds such as greases, pastes and phase change materials. These materials show no signs of elastic behavior or a tendency to return to their original shape after the deformation stresses have been removed.
Type II
Viscoelastic solids in which deformation stresses are ultimately compensated by internal material stresses, thereby limiting further deformation. Examples of this are gels as well as soft and hard rubbers. These materials have linear-elastic properties with a significant deflection in relation to the material thickness.
Type III
Elastic solids that exhibit negligible deflection. Examples include ceramics, metals and some types of plastics.
Application example: Measurement of a type 1 viscous thermal paste (at 60 °C)
Measurement of the thermal impedance (effective thermal conductivity) of a viscous thermal paste (sample type 1) at 60 °C. Several samples with nominal thicknesses between 0.25 mm and 1.50 mm were analyzed to quantify the temperature gradient and the resulting thermal impedance under unpressurized conditions.
Automotive, aerospace
Thermal interface materials (TIMs) are essential components in automotive and aerospace systems where efficient heat dissipation is critical to performance, reliability and durability. They improve heat transfer between power electronics, batteries, cooling systems and structural components by minimizing thermal contact resistance at interfaces.
The TIM L58 enables the precise characterization of thermal conductivity, thermal resistance and interface performance under realistic temperature and pressure conditions. This supports the development and optimization of thermal management solutions for electric vehicles, battery systems, avionics and radar.
Application: Measurement of Vespel™ (at 50 °C, 1 MPa)
Measurement of the thermal impedance (thermal conductivity) of a 25 mm x 25 mm Vespel™ sample at 50 °C (TH = 70 °C, TC = 30 °C) and a contact pressure of 1 MPa. Three different samples with a thickness between 1.1 mm and 3.08 mm were measured to determine the apparent thermal conductivity and the thermal contact resistance (using linear regression).
Application: Temperature-dependent measurement of Vespel™
Representation of the temperature-dependent apparent thermal conductivity of a 25 mm × 25 mm Vespel™ sample in the temperature range from 40 °C to 150 °C at a constant contact pressure of 1 MPa.
Well informed
