{"id":27453,"date":"2024-07-18T11:06:03","date_gmt":"2024-07-18T09:06:03","guid":{"rendered":"https:\/\/www.linseis.com\/messgeraete\/thermal-conductivity\/tim-tester\/"},"modified":"2026-07-30T11:51:14","modified_gmt":"2026-07-30T09:51:14","slug":"tim-tester-l58","status":"publish","type":"messgeraete","link":"https:\/\/www.linseis.com\/en\/instruments\/thermal-conductivity\/tim-tester-l58\/","title":{"rendered":"TIM L58"},"content":{"rendered":"\t\t
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TIM L58: Test device for thermally conductive materials for detailed characterization of TIM<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t
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The LINSEIS TIM L58<\/b> is a high-end system for the precise characterization of thermally conductive materials (TIMs) under realistic contact pressure and temperature conditions. The device enables the precise determination of the thermal impedance<\/b><\/a>thermal resistance<\/b> and apparent thermal conductivity<\/b><\/a><\/b> in accordance with the ASTM D5470 standard. The TIM L58 was developed for applications in the fields of electronics<\/b><\/a>, battery technology<\/b><\/a>, semiconductor cooling<\/b><\/a> and advanced thermal management<\/b> and supports the analysis of viscous TIM<\/strong><\/a>-pastes, pads, films, polymers and metallic interface materials. With automatic pressure control up to 16 MPa, integrated thickness determination and a temperature range of -30 \u00b0C to 450 \u00b0C, the system offers outstanding flexibility, reproducibility and precision to industry standards. <\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t

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Unique features<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t
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Electronics upgrade<\/h3>

The completely redesigned electronics of the TIM L58 provide intelligent control of all measurement processes and ensure maximum process reliability. The close integration of hardware and LiEAP software enables reproducible measurement results with minimal operator effort. <\/p>

The advantages of the new electronics include:<\/p>

  • Automatic Calibration<\/b>
    <\/span>Reduces operator errors and ensures consistently accurate measurement results.<\/li>
  • Fully Automated Measurement Processes<\/b>
    <\/span>Measurement, control, and data analysis are software-controlled.<\/li>
  • Smart Measurement Profiles<\/b><\/span>
    Freely definable temperature, pressure, and cycle programs.<\/li>
  • Integrated LiEAP Platform<\/b><\/span>
    Unified control of hardware, software, and data analysis.<\/li>
  • High process reliability<\/b><\/span>
    Consistent and reproducible results with every measurement.<\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t
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    New Hardware Features<\/h3>

    The TIM L58’s modular measurement platform was designed for maximum flexibility and the highest precision. High-performance actuators, high-resolution sensors, and interchangeable measurement components allow for optimal adaptation to a wide variety of thermal interface materials. <\/p>

    Hardware highlights include:<\/p>

    • NEW:<\/span> Exchangeable Meter bars<\/b>
      Exchangeablemeter bars made of various materials and with different geometries for application-specific measurements.<\/li>
    • Plug-and-Play Technology<\/b><\/span>
      Automatic detection of all calibration and configuration data.<\/li>
    • Automatic Pressure Control<\/b><\/span>
      Reproducible contact forces up to 16 MPa.<\/li>
    • High-resolution LVDT measurement<\/b><\/span>
      Precise determination of sample thickness to within \u00b15 \u00b5m.<\/li>
    • Modular System Design<\/b><\/span>
      Optionally available with a vacuum chamber, safety housing, or custom extensions.<\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t
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      Software improvements <\/h3><\/span>\n\t\t\t\t\t\t\t\n\t\t\t<\/path><\/svg><\/span>\n\t\t\t<\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t
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      The TIM-L58 software platform combines intelligent automation, reliable process control, and advanced analysis tools for efficient and reproducible TIM characterization.<\/p>

      The benefits of the optimized software architecture include:<\/p>

      • Integrated LiEAP Platform
        <\/b>Unified control, analysis, and device communication in a single software environment.<\/li>
      • Automated Measurement Procedures<\/b>
        Fully automated pressure, temperature, and cycle control for reproducible TIM analysis.<\/li>
      • Advanced Data Analysis<\/b>
        Tools for real-time visualization, trend comparison, and statistical analysis.<\/li>
      • Reliable process safety<\/b>
        Automatic calibration, thermocouple monitoring, and secure data handling.<\/li>
      • Flexible plugin architecture<\/b>
        Expandable software modules for temperature cycling, thickness modulation, and quality management.<\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t
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        The integrated electromechanical pressure system enables precise and reproducible control of the contact force up to 16 MPa for realistic TIM characterization under application-relevant conditions.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t

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        Integrated Thickness Measurement <\/h3><\/span>\n\t\t\t\t\t\t\t\n\t\t\t<\/path><\/svg><\/span>\n\t\t\t<\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t
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        A high-resolution LVDT system continuously measures the sample thickness during operation, ensuring extremely accurate calculations of thermal resistance and thermal conductivity.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t

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        Temperature Cycling and Reliability Tests <\/h3><\/span>\n\t\t\t\t\t\t\t\n\t\t\t<\/path><\/svg><\/span>\n\t\t\t<\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t
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        The TIM L58 supports automated temperature cycling and long-term stability testing to evaluate the aging of thermal interface materials, “pump-out” effects, and thermal reliability under repeated stress conditions.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t

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        Measurements according to ASTM D5470 <\/h3><\/span>\n\t\t\t\t\t\t\t\n\t\t\t<\/path><\/svg><\/span>\n\t\t\t<\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t
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        The system performs standardized measurements of steady-state heat flux in accordance with ASTM D5470, thereby enabling directly comparable and reproducible results in the characterization of thermal interface materials (TIM).<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t