LFA 500 (Thermal Conductivity / Diffusivity)
Light Flash - Easy and cost effective measurements
Information of the thermo physical properties of materials and heat transfer optimization of final products is becoming more and more vital for industrial applications. Over the past few decades, the flash method has developed into the most commonly used technique for the measurement of the thermal diffusivity and thermal conductivity of various kinds of solids, powders and liquids.
The Linseis LFA 500 Light Flash offer a versatile tool to measure the Thermal Diffusivity, Thermal Conductivity and Specific Heat Values for up to 18 Samples at the same time.
The sample is positioned on a sample robot, located in a furnace. The furnace is then held at a predetermined temperature. At this temperature the sample bottom is then irradiated with a programmed energy pulse (flash lamp). This energy pulse results in a homogeneous temperature rise at the sample top. The resulting temperature rise on the top surface of the sample is measured by a high speed IR detector and thermal diffusivity values are computed from the temperature rise versus time data.
|Temperature range:||-100°C up to 500°C|
|RT up to 500°C or 1000°C|
|Pulse energy:||15 J/pulse|
|Measuring range alpha||0.01 up to 2000 mm2/s|
|Measuring range lambda:||0.1 to 4000 W/(m∙K)|
|Repeatability cp:||±3% (for most materials)|
|Repeatability alpha:||±1.9% (for most materials)|
|Accuracy cp:||±5% (for most materials)|
|Accuracy alpha:||±2.4% (for most materials)|
|Pulse length:||Software adjustable|
|Sensor type:||InSb, LN2 cooled|
|Sample dimensions:||∅ 3, 6, 10, 12.7 or 25.4 mm|
|square samples 10x10 or 20x20 mm|
|Sample Thickness:||0.1 mm ... 6 mm|
|Nr. of Samples:||Sample robot for up to 18 samples|
|Sample holder:||Graphite, Al2O3, metal, SiC, others|
|optional: liquids, powders, pastes etc|
|Atmospheres:||inert, oxidizing, reducing, vacuum|
|Data acquisition:||2 MHz|
All thermo analytical devices of LINSEIS are PC controlled, the individual software modules exclusively run under Microsoft® Windows® operating systems. The complete software consists of 3 modules: temperature control, data acquisition and data evaluation. The Linseis 32 - bit software encounters all essential features for measurement preparation, execution and evaluation, just like with other thermo analytical experiments.
- Precise pulse length correction, pulse mapping
- Heat-loss corrections
- Analysis of 2- or 3-layers systems
- Wizard for selection of the perfect evaluation model
- Specific heat determination
- Contact resistance determination in multi-layer systems
- Automatic or manual input of related measurement data (density, specific heat)
- Model wizard for selection of the appropriate model
- Finite pulse correction
- Heat loss correction
- Multilayer model
- Determination of contact resistance
- Cp (Specific Heat) determination by comparative method
- Easy and user-friendly data input for temperature segments, gases etc.
- Controllable sample robot
- Software automatically displays corrected measurements after the energy pulse
- Fully automated measurement procedure for multi sample measurements
Automotive / Aviation / Aerospace, Research, Development and Academia, Chemical
Application Example: PTFE “Polytetrafluoroethylene”
Chemical processing and petrochemical sectors: used for vessel linings, seals, spacers, gaskets, well-drilling parts and washers, since PTFE is chemically inert and resistant to corrosion Laboratory applications: Tubing, piping, containers and vessels due to resistance to chemicals and the absence of contaminants attaching to the surface of PTFE products Electrical industry: used as an insulator in the form of spacers, tubing and the like Virgin PTFE had been approved by the FDA for use in the pharmaceutical, beverage, food and cosmetics industries in the form of conveyor components, slides, guide rails, along with other parts used in ovens and other heated systems. Semiconductor sector: used as an insulator in the production of discrete components such as capacitors and in the chip manufacturing process.