Dielectric Analysis

Dielectric Analysis - Dielectric cure monitoring

Linseis Dielectric Analyser

Dielectric cure monitoring measures electrical properties to determine the cure state and viscosity of thermoset materials, at the same time providing insight into chemistry, reaction rate, formulation and physical parameters. Instruments, s

ensors and software from Lambient Technologies are designed for flexibility and ease of use—together they form an integrated system for studying polymers and using the results for optimizing the final product.

Dielectric cure monitoring is the only method that can be used in Research and Development, Quality Assurance/Quality Control, and manufacturing, making quantitative information readily applicable and readily transferrable to every aspect of polymer processing.

Processing Environments

  • Ovens
  • Presses
  • Autoclaves
  • Pultruders and extruders
  • Batch reaction vessels


    Dimensions: 17” W x 16” L x 3.25” H 
    Weight 16 lbs  
    Power: 100 VAC – 240 VAC, 50/60 Hz autoswitching universal input, 4 A max
    Communications: RS-232C, USB with adapter




      • Epoxy
      • Polyurethane
      • Polyester
      • Polystyrene
      • Composites and laminates
      • Bulk/Sheet molding compound
      • Paints and coatings


      • Formulation, reaction rate and cure studies
      • Diffusion studies
      • Cure and process development/monitoring
      • Materials testing
      • Statistical quality control